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    满足市面上90%以上固晶工艺要求，多芯片正面贴装、倒装芯片贴装、共晶焊、预烧结，工艺匹配率100%，国内首家关键技术突破已获得国家多项发明专利的多功能高精度固晶机。
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    Press Fit 伺服压接3

    满足市面上90%以上固晶工艺要求，多芯片正面贴装、倒装芯片贴装、共晶焊、预烧结，工艺匹配率100%，国内首家关键技术突破已获得国家多项发明专利的多功能高精度固晶机。
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    Press Fit 伺服压接4

    满足市面上90%以上固晶工艺要求，多芯片正面贴装、倒装芯片贴装、共晶焊、预烧结，工艺匹配率100%，国内首家关键技术突破已获得国家多项发明专利的多功能高精度固晶机。
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